EMC328x series modules are mainly used in high performance modules of Wi-Fi/BLE gateway applications in the Internet of Things. It has a dual-core microcontroller with ultra-high integration, supports 2.4 GHz Wi-Fi and BLE 5.0 wireless communication technology, and contains large capacity Flash, RAM to meet the data transmission, storage and protocol of various Internet of Things gateway.

EMC3380 is a high-performance module mainly used in voice applications of the Internet of Things. It has a dual-core microcontroller with ultra-high integration, supports 2.4/5GHz dual-band Wi-Fi and BLE 5.0 wireless communication technology, and includes large capacity Flash, RAM, audio codec and audio digital coprocessor to meet various complex requirements in speech application.

The EMW307x series modules are mainly used for IoT data communication. Data collection and control is realized through a rich peripheral interface, and data can be transmitted to the Internet of Things cloud service platform through a Wi-Fi network connection to realize the Internet of Everything. This series of modules is used in a wide range of IoT applications through a variety of different form factors, interface types, antenna interfaces and temperature range.

EMW3290 is a cost-effective, dual-antenna embedded Wi-Fi & BLE module introduced by Shanghai MXCHIP. With dual on-board antennas, Wi-Fi and BLE support simultaneous data transmission and reception while ensuring isolation between antennas.

EMW3239 is an embedded module supplied by 3.3V voltage with radio-frequency chip with both Wi-Fi and BT4.1 and the ARM Cortex-M4 MCU operating at a 100 MHz frequency. SRAM up to 256KB, on-chip Flash up to 1MB and off-chip up to 2MB. EMW3239 has abundant peripherals supplied for different Wi-Fi and BT devices.

EMB1060 is a low-power embedded Bluetooth module developed by Shanghai MXCHIP information Technology Co., Ltd. It integrates an ARM Cortex-M0 core MCU, BLE/2.4G Radio module, 24KB RAM, 160KB Flash and a wealth of peripheral resources. A stamp port package interface design is available.

EMW3031 is one embedded Wi-Fi module designed by MXCHIP of low-power, small-size and low-cost. It integrates one 100MHz Cortex-M4 microcontroller of 192Kbytes RAM with another 2Mbytes on-board SPI flash added. Various peripheral interfaces of analog and digital are available. The WLAN chip has two options, one is with PCB antenna and the other one is with external antenna.

EMW3081 is a highly integrated embedded Wi-Fi module by MXCHIP. It integrates ARM Cortex-M3 processor, WLAN MAC/Baseband/RF, 512KB SRAM, 2MB SDRAM and 2MB SPI Flash. The operating voltage is 3.3V, and it has two kinds of packages: half-hole SMT and DIP package. Peripherals: 1x HS UART / 1x SPI /1x I2C / 4x PWM / Up to 15 GPIOs.

EMW3162 is a low-power embedded Wi-Fi module integrates a wireless LAN MAC/baseband /radio, and a Cortex-M3 microcontroller STM32F205 that runs a unique "self-hosted" Wi-Fi networking library and software application stack. EMW3162 has 1M bytes flash, 128k RAM and rich peripherals for your embedded Wi-Fi applications.

EMW3165 is one embedded Wi-Fi module designed by MXCHIP of low-power, small-size and low-cost. It integrates one Cortex-M4 microcontroller of 128Kbytes RAM and 512Kbytes on-chip flash with another 2Mbytes on-board SPI flash added. Various peripheral interfaces of analog and digital are available. The power supply voltage is 3.3V. It applies half-hole footprint for hand-soldering.

EMW3166 is one embedded Wi-Fi module of low-power, small-size and low-cost designed by MXCHIP. It integrates one Cortex-M4 microcontroller of 256Kbytes SRAM and 1Mbytes on-chip flash with another 2Mbytes on-board SPI flash added. Various peripheral interfaces of analog and digital are available. The power supply voltage is 3.3V. It applies half-hole footprint for hand-soldering.

EMW3060 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM9, WLAN MAC/Baseband/RF. Maximum frequency 120MHz with 256KB SRAM and 2MB FLASH. Power supply is DC 3.3V. Mounting mode is LGA SMT or DIP(Dual In-line Package). Peripherals: 2xUART / 1x SPI /2x I2C / Up to 15 GPIOs.